Component placement machine and component placement method
US10701849B2 · kind B2 · utility
0Cited by
6References
9Claims
0Family size
Assignee
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Key dates
| Filing date | May 16, 2017 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Jan 12, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A lower surface of a board arranged at a working position is supported by a board supporter, and heights of a plurality of portions of the lower surface of the board are measured by a plurality of height measuring instruments attached to the board supporter. A component is installed on the board by control of a height of the installation of the component by an installation head and with respect to the board, which has the lower surface supported by the board supporter, being performed based on the height of the plurality of portions of the lower surface of the board measured by the plurality of height measuring instruments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.