Machine for the laser working of profiles and method for carrying out an inclined cutting operation on a profile by means of this machine
US10702950B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2016 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | May 7, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/0884
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A machine and method for laser working of profiles and in particular for carrying out an inclined cutting operation on profiles are provided. Before working operation, a support and guide device are positioned in a given starting position along the longitudinal axis of the profile with respect to a working head. During working operation, the support and guide device are moved along the longitudinal axis integrally with a feeding device, that is with the profile, so as to keep constant the extent of the projection of the profile from the support and guide device. Integral movement of the support and guide device with the feeding device is limited to the portion of the movement of the feeding device which is required to compensate for tilting movements of the working head about an axis of oscillation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.