Resin composition, prepreg, metal-foil-clad laminate, resin sheet, and printed circuit board
US10703855B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Sep 1, 2017 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Sep 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0355
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A resin composition containing:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.