Resin composition and article made therefrom
US10703905B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2017 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Apr 24, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a resin composition, which comprises 30 parts by weight to 90 parts by weight of a maleimide resin and 15 parts by weight to 60 parts by weight of a benzoxazine resin. The resin composition may be fabricated into various articles, such as prepregs, prepregs with copper foil, resin films, resin films with copper foil, laminates or printed circuit boards, which possess at least one, more or all of the following properties: high peel strength, high thermal resistance after moisture absorption, high glass transition temperature, low thermal expansion, high thermal resistance, low dielectric constant, low dissipation factor and so on.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.