Adhesive delamination layer including at least one non-linear organopolysiloxane
US10703946B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2017 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Aug 9, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/6835
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesive delamination layer including at least one non-linear organopolysiloxane and methods for display device substrate processing are disclosed. The method includes securing the display device substrate to a carrier substrate with an adhesive delamination layer including a cured product of curing a precursor adhesive composition. The precursor adhesive composition includes Component (A), a hydrogenorganopolysiloxane and Component (B), a (C2-C20)alkenyl-functionalized organopolysiloxane, wherein the (C2-C20)alkenyl group is uninterrupted or interrupted by 1, 2, or 3 groups independently chosen from —O—, —S—, substituted or unsubstituted —NH—, —(O—(C2-C3)alkylene)n- wherein n is 1 to 1,000, —Si((C1-C5)alkoxy)2-, and —Si((C1-C5)alkyl)2- wherein at least one of Component (A) and Component (B) is non-linear.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.