Slurry, polishing fluid set, polishing fluid, and substrate polishing method using same
US10703947B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2018 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | May 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The slurry of the invention comprises abrasive grains and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %. The polishing liquid of the invention comprises abrasive grains, an additive and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.