Die assembly and method of using same
US10704166B2 · kind B2 · utility
2Cited by
60References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 13, 2010 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Dec 6, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C48/05
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A die assembly suitable for spinning filaments and more particularly to a die assembly having a fluid environment around the die assembly's filament exit holes is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.