High throughput fabrication of soft machines
US10704537B2 · kind B2 · utility
1Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 2018 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Aug 12, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24983
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A soft robot device includes at least a first thermoplastic layer and a second thermoplastic layer, wherein at least one layer is comprised of an extensible thermoplastic material; at least one layer is an inextensible layer; and at least one layer comprises a pneumatic network, wherein the pneumatic network is configured to be in fluidic contact with a pressurizing source, wherein the first and second thermoplastic layers are thermally bonded to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.