Method for manufacturing a smart card module and a smart card
US10706346B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 25, 2017 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Jan 25, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/183
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for producing a chip card module. According to this method, the following are produced: a module with a substrate having contacts and an electronic chip connected to at least some contacts; an antenna on a carrier, this antenna including two ends, each equipped with a connection land; a cavity in at least one layer of the card at least partially covering the carrier, in order to house the module and to expose the connection lands of the antenna; a first end of a wire is connected directly to a connection pad of the chip, and another portion is connected directly to a connection land of the antenna, after having inserted the module into the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.