Systems and methods for dicing samples using a bessel beam matrix

US10707130B2 · kind B2 · utility

Assignee

• The Chinese University of Hong Kong · CN

Inventors

• Shih-Chi Chen · Hong Kong, CN
• Hiu Hung Lee · Hong Kong, CN
• Dapeng Zhang · Hong Kong, CN
• Erxuan Zhao · Hong Kong, CN
• Yina Chang · Hong Kong, CN
• Dihan Chen · Hong Kong, CN

Key dates

• Filing date: Mar 5, 2018
• Grant date: Jul 7, 2020
• Expiry date: Mar 5, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67092
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Systems and methods for dicing a sample by a Bessel beam matrix are disclosed. The method for dicing a sample by a Bessel beam matrix may comprise generating a Bessel beam matrix including multiple Bessel beams arranged in a matrix form, according to a predetermined dicing layout of the sample; controlling a focus position of each Bessel beam in the generated Bessel beam matrix; and focusing simultaneously the Bessel beams of the Bessel beam matrix at the respective controlled focus positions within the sample for dicing.