High density multi-component packages
US10707145B2 · kind B2 · utility
22Cited by
4References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2017 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Mar 23, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.