Semiconductor device and method for manufacturing semiconductor device
US10707187B2 · kind B2 · utility
0Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2016 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Nov 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.