Light emitting device package including light emitting devices, light-transmissive substrate, and eutectic bonding layer interposed therebetween and display device using the same
US10707393B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2018 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Jun 15, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting device package including a cell array including first, second and third light emitting devices each including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, the cell array having a first surface and a second surface opposing the first surface, a light-transmissive substrate including a first wavelength conversion portion and a second wavelength conversion portion corresponding to the first light emitting device and the second light emitting device, respectively, and bonded to the first surface, and a eutectic bonding layer including a first light emitting window, a second light emitting window and a third light emitting window corresponding to the first light emitting device, the second light emitting device and the third light emitting device, respectively, and bonding the light-transmissive substrate and the first to third light emitting devices to each other may be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.