3D multi-aperture imaging devices, multi-aperture imaging device, method for providing an output signal of a 3D multi-aperture imaging device and method for capturing a total field of view
US10708570B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2018 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Oct 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/45
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A 3D multi-aperture imaging device includes a plurality of image sensor areas. The 3D multi-aperture imaging device includes a first plurality of optical channels for projecting overlapping first partial fields of view of a total field of view on first image sensor areas of the image sensor and includes a second plurality of optical channels for projecting second partial fields of view of the total field of view overlapping each other and the first partial fields of view on second image sensor areas. The first and second pluralities of optical channels are arranged laterally offset from one another. The 3D multi-aperture imaging device includes a processor that is configured to receive image sensor data from the image sensor that is configured to provide an output signal including a data header, wherein the data header includes information regarding the structure of the 3D multi-aperture imaging device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.