Supporting multiple enabled profiles on single embedded subscriber identity module (eSIM) chip
US10708761B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2019 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Dec 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04W8/205
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A method for enabling multiple subscriber identification module (SIM) profiles on a single embedded SIM includes installing a first SIM profile associated with a first mobile communication service that a user subscribes to and installing a second SIM profile associated with a second mobile communication service that the user subscribes to that is different than the first mobile communication service. The method also includes simultaneously enabling the first SIM profile to communicate with data processing hardware via a dedicated first communication interface and the second SIM profile to communicate with the data processing hardware via a dedicated second communication interface. The method also includes when using the enabled first SIM profile and the enabled second SIM profile, connecting to the first mobile communication service and the second mobile communication service simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.