Patent · US Active

Methods and systems for manufacturing an ultrasound probe

US10710116B2 · kind B2 · utility

0Cited by

1References

11Claims

0Family size

Assignee

General Electric Company · US

Inventors

David A. Chartrand · Mesa, US
Reinhold Bruestle · Zipf, AT

Key dates

Filing date	Sep 21, 2017
Grant date	Jul 14, 2020
Priority date	—
Expiry date	Aug 28, 2038

Classification

Technology area (CPC A)Human Necessities
CPC primaryA61B8/4483
WIPO fieldMedical technology
WIPO sectorInstruments

Abstract

Systems and methods described herein generally relate to forming a conductive layer of an ultrasound probe. The systems and methods form an ultrasound probe that includes a piezoelectric layer, and first and second matching layers. The first matching layer is interposed between the second matching layer and the piezoelectric layer. The second matching layer formed from a material having a select acoustic impedance from a laser activated molded interconnect device (MID) or a three-dimensional printer. The second matching layer being electrically coupled to the piezoelectric layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.