Patent · US Active

Resealable laminate for heat sealed packaging

US10710773B2 · kind B2 · utility

1Cited by

50References

44Claims

0Family size

Assignee

Avery Dennison Corporation · US

Inventors

Xinrong Duan · Shanghai, CN
Martin Daffner · Long Beach, US
Zhijian Xue · Ludwigshafen, DE

Key dates

Filing date	Mar 29, 2011
Grant date	Jul 14, 2020
Priority date	—
Expiry date	Mar 29, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24942
WIPO fieldHandling
WIPO sectorMechanical engineering

Abstract

A resealable package assembly is described. The package assembly includes a selectively positionable flap that covers an aperture or enables access through the aperture into the package. The flap and package include provisions for releasably engaging the flap to the package to seal the interior of the package. Provisions for grasping the tab and indicating whether tampering has occurred are also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.