Methods and apparatus for cutting a substrate
US10710922B2 · kind B2 · utility
1Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2016 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Aug 22, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and apparatus for cutting a substrate are disclosed. In one arrangement, a plurality of recesses are formed in the surface of the substrate. The recesses as such that a stress can be applied to the substrate that is concentrated by the recesses. The concentrated stress causes the substrate to be cut along a cutting line that passes through the recesses. The cutting occurs via propagation of a crack through the recesses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.