Patent · US Active

Curing agents for hydrophobic epoxy compositions

US10711154B1 · kind B1 · utility

0Cited by
4References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 19, 2018
Grant dateJul 14, 2020
Priority date
Expiry dateJul 28, 2038

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08K5/0008
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

An hydrophobic epoxy resin composition including at least one ortho-substituted glycidyl ether, at least one ortho, ortho′-disubstituted glycidyl ether, at least one ortho, meta′-disubstituted glycidyl ether, at least one amine/aniline curing agent, and at least one organic solvent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.