Patent · US Active

Pressure-sensitive adhesive comprising a polymer component and a saccharide component and method for bonding a first substrate to a second substrate with same

US10711164B2 · kind B2 · utility

0Cited by

1References

12Claims

0Family size

Assignee

tesa SE · DE

Inventors

Manfred Spies · Bad Bramstedt, DE
David Pilz · Corvallis, US

Key dates

Filing date	Nov 24, 2016
Grant date	Jul 14, 2020
Priority date	—
Expiry date	Nov 24, 2036

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J133/08
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Pressure-sensitive adhesive compound comprising a polymer component and a saccharide component, wherein the saccharide component is formed from one or more monosaccharides, disaccharides, oligosaccharides, or polysaccharides, and/or one or more modified saccharide derivatives, which can be derived from monosaccharides, disaccharides, oligosaccharides or polysaccharides by modifying one, several, or all OH groups contained in the respective saccharide.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.