Beryllium-free high-strength copper alloys
US10711329B2 · kind B2 · utility
4Cited by
11References
2Claims
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Key dates
| Filing date | Dec 18, 2017 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Mar 22, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16C33/121
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A beryllium-free high-strength copper alloy includes, about 10-30 vol % of L12-(Ni,Cu)3(Al,Sn), and substantially excludes cellular discontinuous precipitation around grain boundaries. The alloy may include at least one component selected from the group consisting of: Ag, Cr, Mn, Nb, Ti, and V, and the balance Cu.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.