Polycrystalline diamond compact with gradient interfacial layer
US10711331B2 · kind B2 · utility
2Cited by
91References
22Claims
0Family size
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Key dates
| Filing date | Apr 28, 2015 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Apr 28, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present disclosure relates to a polycrystalline diamond compact (PDC) including a gradient interfacial layer between a thermally stable diamond (TSP) table and a base, such as a substrate or an earth-boring drill bit body. The gradient interfacial layer has a gradient of coefficients of thermal expansion between that of the diamond and the base. The disclosure also relates to methods of forming a gradient interfacial layer and a PDC containing such a layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.