Patent · US Active

Optical sensor package

US10712197B2 · kind B2 · utility

0Cited by

67References

20Claims

0Family size

Assignee

Analog Devices Global Unlimited Company · BM

Inventors

David Bolognia · North Andover, US
Camille Huin · Cambridge, US
Brian Hall · North Andover, US

Key dates

Filing date	Jan 11, 2018
Grant date	Jul 14, 2020
Priority date	—
Expiry date	May 12, 2038

Classification

Technology area (CPC G)Physics
CPC primaryG01J2001/0257
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

An optical device package is disclosed. The optical device package includes a substrate that passes light at an optical wavelength. The optical device package also includes an optical device assembly that is mounted to the substrate. The optical device assembly comprises an optical device die. The optical device die has a first surface that is mounted to and facing the substrate and a second surface that is opposite the first surface. The optical device package further includes a molding compound that is disposed at least partially over the second surface of the integrated device die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.