Electronic power module and electrical power converter incorporating same
US10714406B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2018 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Apr 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The module (PM1) has an architecture with 3D stacking of the electronic power switching chips (IT, ID) and comprises first and second dielectric substrates (SH, SL) that are intended to come into thermal contact with first and second heat sinks (DH, DL), respectively, at least one pair of first and second stacked electronic power switching chips (ITHS, IDHS; ITHS, IDHS) and a common intermediate substrate (SC), the first and second electronic power switching chips being sandwiched between the first dielectric substrate and the common intermediate substrate and between the common intermediate substrate and the second dielectric substrate, respectively. According to the invention, the common intermediate substrate is a metal element formed as a single piece and comprises a central portion for the implantation of the electronic power switching chips and at least one.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.