Patent · US Active

Electronic device having cobalt coated aluminum contact pads

US10714439B2 · kind B2 · utility

0Cited by
2References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 21, 2018
Grant dateJul 14, 2020
Priority date
Expiry dateAug 21, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/00011
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A system and method for bonding an electrically conductive mechanical interconnector (e.g., a bonding wire, solder, etc.) to an electrical contact (e.g., contact pad, termination on a printed circuit board (PCB), etc.) made from an electrically conductive metal (e.g., aluminum) on an electronic device (e.g., integrated circuit (IC), die, wafer, PCB, etc.) is provided. The electrical contact is chemically coated with a metal (e.g., cobalt) that provides a protective barrier between the mechanical interconnector and the electrical contact. The protective barrier provides a diffusion barrier to inhibit galvanic corrosion (i.e. ion diffusion) between the mechanical interconnector and the electrical contact.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.