Electronic device having cobalt coated aluminum contact pads
US10714439B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2018 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Aug 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method for bonding an electrically conductive mechanical interconnector (e.g., a bonding wire, solder, etc.) to an electrical contact (e.g., contact pad, termination on a printed circuit board (PCB), etc.) made from an electrically conductive metal (e.g., aluminum) on an electronic device (e.g., integrated circuit (IC), die, wafer, PCB, etc.) is provided. The electrical contact is chemically coated with a metal (e.g., cobalt) that provides a protective barrier between the mechanical interconnector and the electrical contact. The protective barrier provides a diffusion barrier to inhibit galvanic corrosion (i.e. ion diffusion) between the mechanical interconnector and the electrical contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.