Manufacturing an on-chip microlens array
US10714520B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2018 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Jul 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/802
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for monolithically fabricating a light field sensor with an array of microlens. Each microlens is formed directly on a surface including a plurality of pixels of the light field sensor formed on a wafer. The manufacturing system performs a preparation of the surface including the plurality of pixels formed on the wafer. The manufacturing system deposits a layer of photoresist on the surface of the wafer. The manufacturing system performs a patterning on the deposited layer to form one or more blocks of cured photoresists. The manufacturing system performs a thermal curing of the one or more blocks of uncured photoresists to form an array of microlens of the light field sensor. Each microlens covers at least one of the plurality of pixels of the light field sensor formed on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.