High frequency module and communication device
US10715186B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 26, 2019 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Mar 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2203/7209
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
In a high frequency module, a first band processing circuit, a second band processing circuit, and a third band processing circuit. The first band processing circuit is used at the same time as the third band processing circuit (D3) when wireless communication is performed. A frequency of a harmonic of a first transmission signal of the first band processing circuit is included in a frequency band of a third reception signal of the third band processing circuit. The second band processing circuit is not used at the same time as the first band processing circuit and the third band processing circuit (D3) when wireless communication is performed and is disposed between the first band processing circuit and the third band processing circuit in a plan view of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.