Direct connection of high speed signals on PCB chip
US10716213B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2018 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Jul 28, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated from particular integrated circuits housed on a printed circuit board, to other locations within a system. More specifically, a signal escape strategy directly connects a high-speed cable to a point on the circuit board which is very close to the integrated circuit itself. A back-side connection methodology is utilized so that electrical signals pass directly from the integrated circuit through a via, to a connection point on the backside of the circuit board. To accommodate this connection, a specially designed interposer and related paddle cards are utilized so the high-speed communication cable can be easily attached.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.