Method of manufacturing electronic device
US10716221B2 · kind B2 · utility
1Cited by
0References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2017 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Dec 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a method for manufacturing an electronic device. The method includes providing a panel to a stage, providing a circuit board, aligning the circuit board so that first pads of the circuit board face a first pad area of the panel and second pads of the circuit board face a second pad area of the panel, and compressing a first portion of the circuit board on which the first pads are arranged to the first pad area of the panel. The aligning of the circuit board occurs via by external contact on one surface of the first portion of the circuit board and one surface of the second portion of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.