Component mounting apparatus
US10716250B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2015 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | May 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0882
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component mounting apparatus is provided with a controller that controls a mounting head. The mounting head is provided with a nozzle holder, a nozzle that is elastically supported to be movable up and down with respect to the nozzle holder, a flange that is provided at a position that is offset from the central axis of the nozzle, and a second engaging section that is able to move the nozzle downward by engaging with the flange and pressing down the flange against the elastic force of a nozzle spring. The controller measures in advance the deviation amount of the tip position of the nozzle between before and after the second engaging section moves the nozzle downward and controls the mounting head so as to suck the component and mount the component on the board taking the deviation amount into account.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.