Implants for bridging osseous defects

US10716603B2 · kind B2 · utility

Assignee

• Biomet Manufacturing, LLC · US

Inventors

• William Scott Van Dyke · Warsaw, US
• Frank A. Liporace · Englewood Cliffs, US
• Dan Dziadosz · Tampa, US
• Jordan Grossman · Warsaw, US
• Jordi Asuncion Marquez · Warsaw, US
• Paul Slagle · Fort Wayne, US
• George J. Haidukewych · Orlando, US
• David Thordarson · Los Angeles, US

Key dates

• Filing date: Feb 21, 2018
• Grant date: Jul 21, 2020
• Expiry date: Feb 21, 2038

Classification

• Technology area (CPC A): Human Necessities
• CPC primary: A61F2310/00011
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

Various modular implants and modular implant systems are disclosed herein, as are methods of implanting the same. The modular implant systems can include modular implants that are stacked on each other to define a modular implant system, which in an example can be used to replace or augment a void in bone. The modular implants can interact with an intramedullary implant to, for instance, assist with a fusion procedure.