Heating and cooling module
US10717338B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2016 |
| Grant date | Jul 21, 2020 |
| Priority date | — |
| Expiry date | Jun 21, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A heating and cooling module for controlling the temperature of at least two coolant circuits, having an evaporator region and a condenser region. The evaporator region has a first flow section through which a first coolant can flow, and the condenser region has a second flow section through which a second coolant can flow. The heating and cooling module has a third flow section through which a refrigerant can flow. The evaporator region and the condenser region are arranged on a common base plate which has the fluid inlets and the fluid outlets for the first coolant, the second coolant, and the refrigerant. The base plate has flow channels, through each of which one of the coolants or the refrigerant can flow. The evaporator region and the condenser region are fluidically connected to the respective fluid inlets and the respective fluid outlets of the base plate via the flow channels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.