Cover based adhesion force measurement system for microelectromechanical system (MEMS)
US10717641B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2017 |
| Grant date | Jul 21, 2020 |
| Priority date | — |
| Expiry date | Aug 3, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0874
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
In some embodiments, a sensor includes a microelectromechanical system (MEMS) structure, a cover, and a bump stop. The MEMS structure is configured to move responsive to electromechanical stimuli. The cover is positioned on the MEMS structure. The cover is configured to mechanically protect the MEMS structure. The bump stop is disposed on a substrate and the bump stop is configured to stop the MEMS structure from moving beyond a certain point. The bump stop is further configured to stop the MEMS structure from making physical contact with the substrate. Moreover, the cover is configured to apply a force to the MEMS structure responsive to a voltage being applied to the cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.