Reinforced polyamide molding compounds having low haze and molded bodies therefrom
US10717816B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2018 |
| Grant date | Jul 21, 2020 |
| Priority date | — |
| Expiry date | Oct 4, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/025
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a polyamide molding compound comprising the following components or consisting of these components: (A) 40 to 95 wt % of a specific polyamide mixture consisting of the polyamides (A1) and (A2); (B) 5 to 50 wt % of at least one glass filler having a refractive index in the range from 1.540 to 1.600; (C) 0 to 10 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100% wt %; wherein the at least one transparent polyamide (A2) has a transparency of at least 90% and a haze of at most 3%. The present invention additionally relates to molded bodies composed of this polyamide molding compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.