Moisture curable compositions

US10717821B2 · kind B2 · utility

Assignee

• Dow Silicones Corporation · US

Inventors

• Davide Dei Santi · Seneffe, BE
• Frederic Gubbels · Houtain-le-Val, BE

Key dates

• Filing date: Mar 23, 2017
• Grant date: Jul 21, 2020
• Expiry date: May 19, 2037

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K2003/265
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A two part moisture curing composition, exhibiting low thermal conductivity, has a part A) and a part B). Part A) comprises either: 1) a siloxane polymer (I) having at least two terminal hydroxyl or hydrolysable groups and a viscosity of from 20,000 to 40,000 mPa·s at 25° C.; or 2) a polymer mixture (II) of polymer (i) a siloxane polymer having at least two terminal hydroxyl or hydrolysable groups and a viscosity≥25,000 mPa·s at 25° C., and polymer (ii) a siloxane polymer having at least two terminal hydroxyl or hydrolysable groups and a viscosity of between 1,000 and 20,000 mPa·s at 25° C. Part A) further comprises a reinforcing filler and a low-density filler, the total filler content being between 30 and 45% in volume of the total composition. Part B) comprises a moisture curing agent formulation comprising a tin based catalyst and one or more crosslinkers.