Thin-film integration compatible with silicon photonics foundry production
US10718904B2 · kind B2 · utility
3Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2018 |
| Grant date | Jul 21, 2020 |
| Priority date | — |
| Expiry date | Aug 4, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12188
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photonic integrated circuit and a method of fabrication are provided which includes: a substrate; a first optical waveguide disposed, at least in part, extending across the substrate, the first optical waveguide being configured to transmit a first mode of light; and a second optical waveguide located at least partially over the first optical waveguide, the second optical waveguide being configured to transmit a second mode of light, wherein the first optical waveguide is vertically coupled to the second optical waveguide through a third optical waveguide disposed below the second waveguide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.