Methods of patterning and making masks for three-dimensional substrates
US10718962B2 · kind B2 · utility
0Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2018 |
| Grant date | Jul 21, 2020 |
| Priority date | — |
| Expiry date | Jul 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/143
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides a method of making a mask for patterning a three-dimensional substrate. A mandrel includes a form machined in a surface corresponding to a shape of the substrate. A layer of material is deposited in a first region of the form and a metal layer is deposited in a second region of the form. A portion of the mandrel is subsequently removed. The present invention also provides a method of patterning a three-dimensional substrate with a mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.