Electronic document having an electrical connection between a chip port and an external electrical connection land that is established via an inlay
US10719754B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2019 |
| Grant date | Jul 21, 2020 |
| Priority date | — |
| Expiry date | Apr 2, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/181
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is an electronic document, a body of which includes an inlay, a part of which forms a spotface of a cavity, and which includes a connection land formed on the part forming the spotface, and a module of which includes an electrical circuit that includes both a first subcircuit configured to electrically connect a port of a chip to the connection land and a second subcircuit configured to electrically connect the connection land to an external electrical contact land of a carrier of the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.