Extended temperature operation for electronic systems using induction heating
US10720371B2 · kind B2 · utility
1Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2016 |
| Grant date | Jul 21, 2020 |
| Priority date | — |
| Expiry date | Sep 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B6/105
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments are generally directed to extended temperature operation for electronic systems using induction heating. An embodiment of an apparatus includes an electronic device including: a die or package; a thermal solution coupled with the die or package for cooling of the die or package; and ferromagnetic material, wherein the ferromagnetic material is to generate induction heating of the die or package in response to an alternating magnetic field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.