Semiconductor package structure and semiconductor module including the same
US10720382B2 · kind B2 · utility
0Cited by
12References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2018 |
| Grant date | Jul 21, 2020 |
| Priority date | — |
| Expiry date | Jul 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are semiconductor package structure and semiconductor modules including the same. The semiconductor module includes a circuit board, a first semiconductor package over the circuit board, and a connection structure on the circuit board and connecting the circuit board and the first semiconductor package. The first semiconductor package includes a first package substrate. A difference in coefficient of thermal expansion between the connection structure and the circuit board may be less than a difference in coefficient of thermal expansion between the circuit board and the first package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.