System of stacking electronic modules on a base board
US10720720B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2019 |
| Grant date | Jul 21, 2020 |
| Priority date | — |
| Expiry date | Mar 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/044
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various systems may benefit from suitable arrangements and configurations of modules. For example, certain electronics systems may benefit from systems and methods for stacking electronic modules on a base board. A system of stacking computer modules can include a base board, which can be a printed circuit board (PCB). The system can also include a first plurality of connectors, mounted to and in electrical communication with the base board. The system can further include a first module, the first module including a second PCB and a second plurality of bottom connectors configured to engage the first plurality of connectors and a third plurality of top connectors. The system can additionally include a second module, the second module including a third PCB and a fourth plurality of bottom connectors configured to engage the third plurality of top connectors of the first module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.