Emitter array with shared via to an ohmic metal shared between adjacent emitters
US10720758B2 · kind B2 · utility
3Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2019 |
| Grant date | Jul 21, 2020 |
| Priority date | — |
| Expiry date | Mar 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S2301/176
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An emitter array may comprise a plurality of emitters that includes two adjacent emitters. The ohmic metal layer may include a portion that is shared by, and located between, the two adjacent emitters. The emitter array may comprise a protective layer over the ohmic metal layer. The emitter array may comprise a via through the protective layer to the portion. The via is shared by, and located between, the two adjacent emitters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.