Laminate production method
US10721823B2 · kind B2 · utility
0Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2015 |
| Grant date | Jul 21, 2020 |
| Priority date | — |
| Expiry date | May 25, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method of manufacturing laminate body by: curing thermosetting resin composition on a support; laminating the curable resin onto a substrate; heating the laminate; forming a via hole in the cured resin layer; peeling the supporting body from the cured composite; performing a second heating of the cured composite; removing resin residue in the via hole of the cured composite; and forming a conductor layer on an inner wall surface of the via hole by electroless plating or a combination of electroless plating and electrolytic plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.