Stacked base heat sink with heat pipes in-line with airflow
US10721838B1 · kind B1 · utility
6Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2018 |
| Grant date | Jul 21, 2020 |
| Priority date | — |
| Expiry date | Nov 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a heat sink includes a lower base, an upper base, a set of fins interposed between the lower base and the upper base, and a plurality of heat pipes running between the lower base and the upper base on opposite sides of the heat sink and in-line with an airflow direction through the set of fins. An apparatus comprising a plurality of the heat sinks is also disclosed herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.