Cooling of dies using solid conductors
US10722930B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2016 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Mar 3, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2013/006
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Dies for forming components, such as sheet components, and methods of producing the dies are disclosed. The die may include a bulk material and a forming surface. A solid conductor may be formed in the bulk material. The solid conductor may be spaced from and extend adjacent to the forming surface and have a melting point that is greater than a melting point of the bulk material. The solid conductor may be configured to absorb heat from the forming surface. There may multiple solid conductors within the bulk material, for example spaced apart and extending along an axis. The solid conductor may be a bundle of carbon fibers, which may be pitch-based. The solid conductor may be conformal to the forming surface, for example, having a constant spacing therefrom. The solid conductor may be cast-in to the die during its production.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.