Sensor assembly and arrangement and method for manufacturing a sensor assembly
US10723615B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
Assignee
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Key dates
| Filing date | May 5, 2017 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | May 5, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/051
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.