Glass composition for micro-D connector sealing
US10723648B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2016 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Mar 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/405
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a tellurium-oxide-based glass composition for forming a glass-to-metal seal to alloys or metals having a coefficient of thermal expansion higher than 16 ppm/° C., said composition comprising TeO2, ZnO, TiO2 and optionally K2O and being essentially free of lead oxide, sodium oxide and vanadium oxide.In addition it relates to the use of the glass composition according to the invention to form a glass-to-metal seal between copper or a copper alloy and an alloy or a metal having a coefficient of thermal expansion higher than 16 ppm/° C., in particular aluminum alloys.It furthermore relates to a connector comprising a contact made of copper or of copper alloy, an insert and/or shell made of a metal or alloy having a coefficient of thermal expansion higher than 16 ppm/° C. and, by way of glass-to-metal sealant between the contact and the insert and/or shell, a tellurium-oxide-based glass having the composition according to the invention.Lastly, it relates to a process for forming a glass-to-metal seal between a contact made of copper or of copper alloy and an insert and/or shell made of metal or alloy having a coefficient of thermal expansion higher than …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.