Modular heat transfer units
US10724761B2 · kind B2 · utility
1Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2018 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Oct 9, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF24F2221/36
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat transfer unit includes housing that includes a compressor, a condenser, one or more fans, and an air duct disposed on a side of the compressor unit. The heat transfer unit is configured such that the unit may operate in a mini-split or stacked configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.