Diamond broad band mirror system and method
US10725214B2 · kind B2 · utility
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2References
7Claims
0Family size
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Key dates
| Filing date | Feb 8, 2018 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Feb 8, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/185
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A broad band mirror system and method, wherein the system includes a mechanical substrate layer, a reflective metal layer on the mechanical substrate level, and a diamond layer, and the method includes the steps of selecting a sacrificial substrate layer, depositing a diamond layer on the substrate layer, smoothing a first surface of the diamond layer, depositing a reflective metal layer on the diamond layer, bonding a mechanical substrate to the diamond layer, removing the sacrificial substrate level, and smoothing a second diamond surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.