Security plugin for a system-on-a-chip platform
US10726162B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2014 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Dec 19, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L2209/76
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
Systems and techniques for a System-on-a-Chip (SoC) security plugin are described herein. A component message may be received at an interconnect endpoint from an SoC component. The interconnect endpoint may pass the component message to a security component via a security interlink. The security component may secure the component message, using a cryptographic engine, to create a secured message. The secured message is delivered back to the interconnect endpoint via the security interlink and transmitted across the interconnect by the interconnect endpoint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.